Material Issues for Microsystems
Author:
Publisher
Springer Berlin Heidelberg
Link
http://link.springer.com/content/pdf/10.1007/978-3-642-18293-8_3
Reference57 articles.
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2. Khoo H. S., K. K. Liu, and F. G. Tseng, (2003), Mechanical strength and interfacial failure analysis of cantilevered SU-8 microposts, J. of Micromech. Microeng., 13: 822–831
3. Greek. S. and S. Johansson, (1997), Tensile testing of thin film microstructure, Proc. SPIE, 3224: 344–351
4. Sharpe W. N., B. Jr. Yuan, and A. Edwarde, (1997), new technique for measuring the mechanical properties of thin film, J. of Microelectromechanical System, 6(3): 193–199
5. Li X. P., G. F. Ding, T. Ando, M. Shilkida, and K. Sato, (2007), Micromechanical characterization of electroplated permalloy films for MEMS, Microsystem Technology, 14: 131–134
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