Analysis of DoD inkjet printhead performance for printable electronics fabrication using dynamic lumped element modeling and swarm intelligence based optimal prediction-Reference-Cited by-同舟云学术

Analysis of DoD inkjet printhead performance for printable electronics fabrication using dynamic lumped element modeling and swarm intelligence based optimal prediction

Published:2015-10 Issue:10 Volume:22 Page:3925-3934
ISSN:2095-2899
Container-title:Journal of Central South University
language:en
Short-container-title:J. Cent. South Univ.

Author:

He Mao-wei,Sun Li-ling,Hu Kun-yuan,Zhu Yun-long,Chen Han-ning

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,General Engineering

Link

http://link.springer.com/content/pdf/10.1007/s11771-015-2937-4.pdf

Reference32 articles.

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3. CHEUNG C L, LOOI T, LENDVAY T S, DRAKE J M, FARHAT W A. Use of 3-dimensional printing technology and silicone modeling in surgical simulation: development and face validation in pediatric laparoscopic pyeloplasty [J]. Journal of Surgical Education, 2014, 71(5): 762–767.

4. JAEHYUNG H, ALAN W, ANTOINE K. Energetics of metal–organic interfaces: New experiments and assessment of the field [J]. Materials Science and Engineering R, 2009, 64: 1–31.

5. BYUNG J K, JE J H. Geometrical characterization of inkjet-printed conductive lines of nanosilver suspensions on a polymer substrate [J]. Thin Solid Films, 2010, 518: 2890–2896.

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