Grain boundary effects on spall behavior of high purity copper cylinder under sweeping detonation
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,General Engineering
Link
https://link.springer.com/content/pdf/10.1007/s11771-022-4980-2.pdf
Reference31 articles.
1. GRAY G T III, HULL L M, LIVESCU V, et al. Influence of sweeping detonation-wave loading on shock hardening and damage evolution during spallation loading in tantalum [J]. EPJ Web of Conferences, 2012, 26: 02004. DOI: https://doi.org/10.1051/epjconf/20122602004.
2. KOSKELO A C, GREENFIELD S R, PAISLEY D L, et al. Dynamics of the onset of damage in metals under shock loading [J]. AIP Conference Proceedings, 2007, 955(1): 557–560. DOI: https://doi.org/10.1063/1.2833143.
3. FURNISH M D, CHHABILDAS L C, REINHART W D, et al. Determination and interpretation of statistics of spatially resolved waveforms in spalled tantalum from 7 to 13 GPa [J]. International Journal of Plasticity, 2009, 25(4): 587–602. DOI: https://doi.org/10.1016/j.ijplas.2008.12.007.
4. ESCOBEDO J P, CERRETA E K, DENNIS-KOLLER D. Effect of crystalline structure on intergranular failure during shock loading [J]. JOM, 2014, 66(1): 156–164. DOI: https://doi.org/10.1007/s11837-013-0798-6.
5. BROWN A D, WAYNE L, PHAM Q, et al. Microstructural effects on damage nucleation in shock-loaded polycrystalline copper [J]. Metallurgical and Materials Transactions A, 2015, 46(10): 4539–4547. DOI: https://doi.org/10.1007/s11661-014-2482-z.
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