Electromagnetic emanation exploration in FPGA-based digital design

Author:

Nguyen Van Toan,Dam Minh Tung,Lee Jeong-GunORCID

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,General Engineering

Reference20 articles.

1. PILSOO L, JAE K L, KYOO Y L, INCHAE S, BOO G K. Analysis of EMI dependence on signal duty and supplied voltage [C]// IEEE Workshop on Signal Propagation on Interconnects. Strasbourg: IEEE, 2009: 1–4.

2. KIM N K, HWANG J S, KIM S Y. EMI prediction of slew-rate controlled I/O buffers by full-wave and circuit Co-simulation [J]. Journal of Semiconductor Technology and Science, 2014, 14(4): 471–477.

3. CHAN R S, TAN N F, MOKHTAR M R. Simultaneous switching noise impact to signal eye diagram on high-speed I/O [C]// 4th Asia Symp on Quality Electronic Design. Penang: IEEE, 2012: 200–205.

4. HARUYA F, YO I, TOSHIO S. Measurement and analysis of SSN and Jitter of FPGA [C]// 2012 Int Symp on Electromagnetic Compatibility. Rome: IEEE, 2012: 1–6.

5. OIKAWA R, GOPE D, JANDHYALA V. Return-path extraction technique for SSO analysis of low-cost wire-bonding BGA packages [J]. IEEE Transaction on Components, Packaging and Manufacturing Technology, 2012, 2(4): 677–686.

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1. Impact of Place and Route Position on FPGA Electromagnetic Emission Characteristics;2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC);2023-10-20

2. Impact of place and route strategy on FPGA electromagnetic emission;Microelectronics Reliability;2021-11

3. Preliminary Study on the Impact of Place and Route Strategy on FPGA Electromagnetic Emission;2021 Argentine Conference on Electronics (CAE);2021-03-11

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