1. HWU F S, SHEU G J, CHEN J C. Thermal modeling and performance of LED packaging for illuminating device [C]// 6th SPIE Inter Conf on Solid State Lighting. San Diego, USA, 2006: J1–J6.
2. ACIKALIN T, GARIMELLA S V, PETROSKI J, RAMAN A. Optimal design of miniature piezoelectric fans for cooling light emitting diodes [C]// 9th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. New York, USA, 2004: 663–671.
3. MA H K, CHEN B R, LAN H W, LIN K T, CHAO C Y. Study of an LED device with vibrating piezoelectric fins [C]// 25th IEEE SEMI-THERM Symposium. CA, USA, 2009: 267–272.
4. CHAU S W, LIN C H, YEH C H, YANG C. Study on the cooling enhancement of LED heat sources via an electrohydrodynamic approach [C]// 33rd Annual Conference of the IEEE Industrial Electronics Society. Taipei, 2007: 2934–2937
5. MA Ze-tao, WANG Xiao-jun, ZHU Da-qing, LIU Sheng. Thermal analysis and modeling of LED arrays integrated with an innovative liquid-cooling module [C]// 6th IEEE Inter Conf on Electronic Packaging Technology. Shenzhen, China, 2005: 1–4.