Experimental study on the flow/ heat transfer performance of micro-scale pin fin coating with super-hydrophobic surface adding Nano particle

Author:

Hua Junye,Duan Yuanyuan,Li Gui,Xu Qiong,Li Dong,Wu Wei,Zhao Xiaobao,Qiu Delai

Funder

Nature Science Foundation Programs of Jiangsu Province Colleges and Universities

Natural Science Foundation of Jiangsu Province of China

Publisher

Springer Science and Business Media LLC

Subject

Fluid Flow and Transfer Processes,Condensed Matter Physics

Reference16 articles.

1. Tuckerman DB, Pease RFW (1981) High performance heat sinking for VLSI. IEEE Electron Device Lett EDL-2(5):126–129

2. Zhang CW, Jiang GL, Guan N, Liu ZG (2014) Resistance characteristics of micro pin fins with different cross-section shape. CIESC J 65(6):2042–2048

3. Guan N, Liu ZG, Zhang CW (2011) Laminar flow characteristics in in-line arranged micro-cylinder groups. CIESC J 62(3):664–671

4. Wei X, Joshi Y (2014) Stacked micro channel heat sinks for liquid cooling of microelectronic components. J Electron Packag 126(1):60–66

5. Yeom T, Simon T, Zhang T, Zhang M, North M, Cui T (2016) Enhanced heat transfer of heat sink channels with micro pin fin roughened walls. Int J Heat Mass Transf 92:617–627

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