Author:
Hua Junye,Duan Yuanyuan,Li Gui,Xu Qiong,Li Dong,Wu Wei,Zhao Xiaobao,Qiu Delai
Funder
Nature Science Foundation Programs of Jiangsu Province Colleges and Universities
Natural Science Foundation of Jiangsu Province of China
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Reference16 articles.
1. Tuckerman DB, Pease RFW (1981) High performance heat sinking for VLSI. IEEE Electron Device Lett EDL-2(5):126–129
2. Zhang CW, Jiang GL, Guan N, Liu ZG (2014) Resistance characteristics of micro pin fins with different cross-section shape. CIESC J 65(6):2042–2048
3. Guan N, Liu ZG, Zhang CW (2011) Laminar flow characteristics in in-line arranged micro-cylinder groups. CIESC J 62(3):664–671
4. Wei X, Joshi Y (2014) Stacked micro channel heat sinks for liquid cooling of microelectronic components. J Electron Packag 126(1):60–66
5. Yeom T, Simon T, Zhang T, Zhang M, North M, Cui T (2016) Enhanced heat transfer of heat sink channels with micro pin fin roughened walls. Int J Heat Mass Transf 92:617–627
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献