Investigation on the structure function of an electronic packaging to verify detailed thermal model assumptions
Author:
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
https://link.springer.com/content/pdf/10.1007/s00231-022-03335-7.pdf
Reference37 articles.
1. Lasance CJM (2001) Two Benchmarks to Facilitate the Study of Compact Thermal Modeling Phenomena. IEEE Trans Compon Packaging Technol 24:559–565. https://doi.org/10.1109/6144.974943
2. Monier-Vinard E, Bissuel V, Laraqi N, Dia C (2014) Latest developments of compact thermal modeling of system in package devices by means of genetic algorithm. 14th IEEE ITherm. https://doi.org/10.1109/ITHERM.2014.6892390
3. JESD15–4 (2008) DELPHI compact thermal model guideline
4. Monier-Vinard E, Dia CT, Bissuel V, Daniel O, Laraqi N (2011) Extension of the DELPHI methodology to dynamic compact thermal model of electronic component. 17th IEEE THERMINIC
5. Bissuel V, Fox V, Monier-Vinard E, Neveu A, Joly F, Daniel O (2019) Multi-port dynamic compact thermal models of BGA package using model order reduction and metaheuristic optimization. 18th IEEE ITherm. https://doi.org/10.1109/ITHERM.2019.8757303
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