Experimental study of transient forced convection heat transfer from simulated electronic chips
Author:
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s00231-004-0598-1.pdf
Reference18 articles.
1. Xu GP, Tso CP, Tou KW (1996) A review on direct liquid cooling channel flow with single-phase for electronic systems. J Electro Manuf 6:115?125
2. Mudawar I (1992) Direct-immersion cooling for high power electronic chips. In: Proceedings of 1992 intersociety conference on thermal phenomenon, pp 74?84
3. Chu RC (1986) Heat transfer in electronic systems. In: Proceedings 8th international heat transfer conference, San Francisco Vol. 1, pp 293?305
4. Hannemann R, Fox LR, Mahalingam M (1987) Heat transfer in microelectronic components. In: Proceedings International Symposium on cooling technology for electronic equipment, Hawaii
5. Siegel RE, Sparrow EM (1959) Transient heat transfer for laminar forced convection in the thermal entrance region of flat ducts. J Heat Transfer 81C:29?36
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