Numerical simulation of heat transfer in a micro channel heat sinks using nanofluids

Author:

Farsad E.,Abbasi S. P.,Zabihi M. S.,Sabbaghzadeh J.

Publisher

Springer Science and Business Media LLC

Subject

Fluid Flow and Transfer Processes,Condensed Matter Physics

Reference26 articles.

1. Linan J, Jae MK, Evelyn W (2002) Cross-linked microchannels for VLSI Hotspot cooling. In: Proceedings of IMECE 2002, ASME, New York, pp 1–5

2. Bjorn P (1996) Cooling of electronics by heat pipes and thermosyphons. In: National heat transfer conference, vol 329(7). ASME, New York, pp 97–108

3. Jiang L, Wong M (1999) Phase change in micro channel heatsinks with integrated temperature sensors. J Microelectromech Syst 8(4):358–365

4. Evelyn NW, Lian Z (2002) Micro machined jet arrays for liquid impingement cooling of VLSI chips, Solid-State Sensor, Actuator and Micro systems workshop, Hilton head island, pp 46–49

5. Lee J, Mudawar I (2005) Two-phase flow in high heat flux micro channel heat sink for refrigeration cooling applications: partI: pressure drop characteristics. Int J Heat Mass Transf 48:928–940

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