1. Bergles AE, Chu RC, Seely HJ (1977) Survey of heat transfer technique applied to electronic packages. In: Proceedings of technical program, national electronic packaging and production conference, Anaheim, CA
2. Yovanovich MM (1981) New contact and gap correlations for conforming rough surfaces, AIAA-86-1164, presented at 16th thermo physics Conference, Polo Alto, CA
3. Hegazy AA (1985) Thermal joint conductance of conforming rough surfaces: effect of surface micro-hardness variation. PhD Thesis, University of Waterloo
4. Kraus AD, Chu RC, Bar-Cohen A (1982) Thermal management of microelectronics: past, present and future. computers in mechanical engineering, pp 69–79
5. Yovanovich MM (1977) Thermal contact resistance in microelectronics. In: Proceedings of technical program, national electronic packaging and production conference, Anaheim, CA