Interfacial thermal contact resistance between aluminum nitride and copper at cryogenic temperature
Author:
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s00231-011-0953-y.pdf
Reference14 articles.
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3. Fhjishiro H, Okamoto T, Hirose K (2001) Thermal contact resistance between high-Tc superconductor and copper. Phys C 357–360:785–788
4. Ling S, Huiling W, Yuejin T et al (2005) Experimental investigation into HTS-SMES magnet by cryocooler cooled. J Huazhong Univ Sci Tech (Nature Science Edition) 33(1):90–92
5. Zhao L, Phelan PE (1999) Thermal contact conductance across filled polyimide films at cryogenic temperature. Cryogenics 39:803–809
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