Transient heat conduction in functionally graded thick hollow cylinders by analytical method
Author:
Publisher
Springer Science and Business Media LLC
Subject
Fluid Flow and Transfer Processes,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s00231-006-0158-y.pdf
Reference9 articles.
1. Awaji H (2001) Temperature and stress distributions in a plate of functionally graded materials. In: Fourth International Congress on Thermal Stresses 2001, June 8–11, Osaka, Japan
2. Jin Z-H (2002) An asymptotic solution of temperature field in a strip of a functionally graded material. Int Commun Heat Mass Transfer 29(7):887–895
3. Jabbari M, Sohrabpour S, Eslami MR (2002) Mechanical and thermal stresses in a functionally graded hollow cylinder due to radially symmetric loads. Int J Press Vessels Piping 79:493–497
4. Jabbari M, Sohrabpour S, Eslami MR (2003) General solution for mechanical and thermal stresses in a functionally graded hollow cylinder due to nonaxisymmetric steady-state loads. ASME J Appl Mech 70:111–118
5. Sladek J, Sladek V, Zhang Ch (2003) Transient heat conduction analysis in functionally graded materials by the meshless local boundary integral equation method. Comput Mater Sci 28:494–504
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