Manufacture of a biporous nickel wick and its effect on LHP heat transfer performance enhancement

Author:

Wu S. C.,Hsieh B. H.,Wang D.,Chen Y. M.

Publisher

Springer Science and Business Media LLC

Subject

Fluid Flow and Transfer Processes,Condensed Matter Physics

Reference23 articles.

1. Maidanik YF, Vershinin SV, Kholodov VF, Dolgirev JE, (1985) Heat transfer apparatus, US Patent, No. 5015209

2. Liao Q, Zhao TS (1999) Evaporative heat transfer in a capillary structure heated by a grooved block. J Thermophys Heat Transf 13(1):126–133

3. Rasor NS, Desplat JL (1989) K-max: a material with exceptional heat transfer properties, In: Proceedings IECEC 24, Washington, IECEC 899217

4. Rosenfeld JH, Gernert NJ, North MT (1994) Internally extended surface heat pipe evaporators for microelectronics cooling, Geoffrey F. Hewitt. ASME HTD 273, UK, pp 93–100

5. North MT, Sarraf DB, Rosenfeld JH, Maidanik YF, Vershinin S (1997) High heat flux loop heat pipes, In: Proceedings ESSECS 6, Noordwijk, p 371–376

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