1. Bohr M.T.: Interconnect scaling-the real limiter to high performance ULSI, Proceedings of International Electron Devices Meeting, 241-244 (1995)
2. Szwagierczak, D., Synkiewicz, B., Kulawik, J.: Low dielectric constant composites based on B2O3 and SiO2 rich glasses, cordierite and mullite. Ceram. Int. 44, 14495–14501 (2018)
3. Kimoto, Y., Fujita, T., Furuta, N., Kitamura, A., Suzuki, H.: Development of space-qualified photocurable-silsesquioxane-coated polyimide films. J. Spacecr. Rocket. 53, 1028–1034 (2016)
4. Ogawa E.T., Kim J., Haase G.S., Mogul H.C., McPherson J.W., Leakage, breakdown, and TDDB characteristics of porous low-k silica-based interconnect dielectrics, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual., IEEE, 2003, pp. 166-172.
5. Kim, Y.-H., Hwang, M.S., Kim, H.J., Kim, J.Y., Lee, Y.: Infrared spectroscopy study of low-dielectric-constant fluorine-incorporated and carbon-incorporated silicon oxide films. J. Appl. Phys. 90, 3367–3370 (2001)