Laser-driven micro-explosive bonding of aluminium films to copper and silicon-Reference-Cited by-同舟云学术

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Laser-driven micro-explosive bonding of aluminium films to copper and silicon

Published:1988-06 Issue:6 Volume:23 Page:2181-2186
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Alexander Dale E.,Was Gary S.,Mayer Fred J.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF01115786.pdf

Reference15 articles.

1. ?Explosive Welding?,Mech. Eng. (May 1978) 28.

2. M. B. Frish andP. Nebolsine, ?Surface Coating and Alloying by Laser Induced Heat and Pressure?, Final Report, NSF Grant No. DMR-8260087 (1983).

3. F. J. Mayer andG. E. Busch,J. Appl. Phys. 57 (1985) 827.

4. M. Hongo andJ. Nakabayshi, US Patent 4190759 (1980).

5. T. J. Lane andJ. J. Wynne,IBM Tech. Disclosure Bull. 27 (1984) 446.

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