On temperature prediction of multiple-chip packages by a combined analysis-finite element method

Author:

Wu Horng-Wen,Liu Ming-Che

Publisher

Springer Science and Business Media LLC

Subject

Fluid Flow and Transfer Processes,Condensed Matter Physics

Reference24 articles.

1. Oktay, S.; Hannemann, R.; Bar-Cohen, A.: High heat from a small package. Mechanical Engineering 108 (1986) 36?42

2. Burger, R. M.: The impact of IC's on computer technology. IEEE J. Computer (1984) 88?95.

3. Chu, R. C.; Hwang, U. P.; Simons, R. E.: Conduction cooding for an ISI package: a one-dimensionl approach. IBM J. Res. Develop. 26 (1982) 45?54

4. Oktay, S.; Kamerer, H. C.: A conduction-cooled module for high-performance LSI devices. IBM J. Res. Develop. 26 (1982) 55?66

5. Dean, D. J.: Thermal Design of Electronic Circuit Boards and Packages. Electrochemical Publications Ltd. (1985) 233?290

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