Buckling and vibration analysis of shape memory laminated composite beams under axially heterogeneous in-plane loads in the glass transition temperature region

Author:

Tiwari NileshORCID,Shaikh A. A.

Abstract

AbstractBuckling and vibration study of the shape memory polymer composites (SMPC) across the glass transition temperature under heterogeneous loading conditions are presented. Finite element analysis based on C° continuity equation through the higher order shear deformation theory (HSDT) is employed considering non linear Von Karman approach to estimate critical buckling and vibration for the temperature span from 273 to 373 K. Extensive numerical investigations are presented to understand the effect of temperature, boundary conditions, aspect ratio, fiber orientations, laminate stacking and modes of phenomenon on the buckling and vibration behavior of SMPC beam along with the validation and convergence study. Effect of thermal conditions, particularly in the glass transition region of the shape memory polymer, is considerable and presents cohesive relation between dynamic modulus properties with magnitude of critical buckling and vibration. Moreover, it has also been inferred that type of axial loading condition along with the corresponding boundary conditions significantly affect the buckling and vibration load across the glass transition region.

Publisher

Springer Science and Business Media LLC

Subject

General Earth and Planetary Sciences,General Physics and Astronomy,General Engineering,General Environmental Science,General Materials Science,General Chemical Engineering

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3