An investigation on responses of thermoelastic interactions of transversely isotropic thick circular plate due to ring load with memory-dependent derivatives

Abstract

AbstractThe present investigation has focus on the variations in a transversely isotropic thick circular plate subjected to ring loading. The modified Green Nagdhi (GN) heat conduction equation with and without energy dissipation by introducing memory-dependent derivatives (MDD) with two temperatures has been used to model the problem. General solutions to the field equations have been found using the Hankel and Laplace transform. The analytical expressions of stress, conductive temperature, and components of displacement are obtained in the transformed domain. Physical solutions have been obtained using numerical inversion techniques. The effects of Kernel functions of memory-dependent derivatives have been depicted graphically. The present investigation also reveals some specific cases.