Characterization of postreplication repair in Saccharomyces cerevisiae and effects of rad6, rad18, rev3 and rad52 mutations
Author:
Publisher
Springer Science and Business Media LLC
Subject
Genetics,Molecular Biology
Link
http://link.springer.com/content/pdf/10.1007/BF00352525.pdf
Reference54 articles.
1. Boram WR, Roman H (1976) Recombination in Saccharomyces cerevisiae: a DNA repair mutation associated with elevated mitotic gene conversion. Proc Natl Acad Sci USA 73:2828–2832
2. Buhl SN, Setlow RB, Regan JD (1972) Steps in DNA chain clongation and joining after ultra-violet irradiation of human cells. Int J Radiat Biol 22:417–424
3. Buhl SN, Setlow RB, Regan JD (1973) Recovery of the ability to synthesize DNA in segments of normal size at long times after ultraviolet irradiation of human cells. Biophys J 13:1265–1275
4. Buhl SN, Setlow RB, Regan JD (1974) DNA repair in Potorus tridactylus. Biophys J 14:791–803
5. Burgi E, Hershey AD (1963) Sedimentation rate as a measure of molecular weights of DNA. Biophys J 3:309–321
Cited by 256 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. CARCINOGENICITY STUDIES;Drug Safety Evaluation;2022-12-23
2. Homologous Recombination as a Fundamental Genome Surveillance Mechanism during DNA Replication;Genes;2021-12-09
3. Daughter-strand gaps in DNA replication – substrates of lesion processing and initiators of distress signalling;DNA Repair;2021-09
4. Physical interactions between MCM and Rad51 facilitate replication fork lesion bypass and ssDNA gap filling by non-recombinogenic functions;Cell Reports;2021-07
5. DNA Damage Tolerance in the Yeast Saccharomyces cerevisiae;Russian Journal of Genetics;2021-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3