Fracture toughness characterization of 3D-printed advanced structured specimens by digital image correlation
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanics of Materials,Modeling and Simulation,Computational Mechanics
Link
https://link.springer.com/content/pdf/10.1007/s10704-022-00672-w.pdf
Reference35 articles.
1. Akhoundi B, Nabipour M, Hajami F, Shakoori D (2020) An experimental study of nozzle temperature and heat treatment (annealing) effects on mechanical properties of high-temperature polylactic acid in fused deposition modeling. Polymer Eng Sci 60(5):979–987
2. Allum J, Moetazedian A, Gleadall A, Silberschmidt VV (2020) Interlayer bonding has bulk-material strength in extrusion additive manufacturing: new understanding of anisotropy. Add Manufact 34:101297
3. Ameri B, Taheri-Behrooz F, Aliha MRM (2022) Mixed-mode tensile/shear fracture of the additively manufactured components under dynamic and static loads. Eng Fract Mech 260:108185
4. Amza CG, Zapciu A, Constantin G, Baciu F, Vasile MI (2021) Enhancing mechanical properties of polymer 3d printed parts. Polymers 13(4):562
5. Bahrami B, Ayatollahi MR, Torabi AR (2020) Application of digital image correlation method for determination of mixed mode stress intensity factors in sharp notches. Optics Lasers Eng 124:105830
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Fracture behavior of double edge notch AlSi10Mg alloy fabricated by laser powder bed fusion;Theoretical and Applied Fracture Mechanics;2024-04
2. Additive manufacturing of ULTEM 9085: Weak interface-enriched multi-toughening mechanisms and fracture resistance optimization;Engineering Fracture Mechanics;2024-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3