Deposition of Adherent, Thick Copper Coatings on Glass-Reference-Cited by-同舟云学术

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Deposition of Adherent, Thick Copper Coatings on Glass

Published:1989 Issue: Volume: Page:93-101
ISSN:
Container-title:Metallized Plastics 1
language:
Short-container-title:

Author:

Cowden W. C.,Beat T. G.,Wash T. A.,Dini J. W.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4899-0879-7_8

Reference5 articles.

1. J. W. Dini, Plating Surface Finish, 72, 48 (July 1985)

2. J. W. Dini, Synergism of electroplating and vacuum processes, Proceedings First International SAMPE Metals Conference (August 1987)

3. D. M. Mattox, Thin Solid Films, 18, 173 (1973)

4. V. A. Lamb and D. R. Valentine, Plating, 52, 1289 (1965)

5. V. A. Lamb and D. R. Valentine, Plating, 53, 86 (1966)

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrodeposition of Copper;Modern Electroplating;2011-02-24

2. Electroplating onto inorganic glass surfaces - Part II: Mechanical treatment to improve adhesion‡;Journal of Adhesion Science and Technology;1995-01

3. Electroplating onto inorganic glass surfaces - Part I: Surface modification to improve adhesion‡;Journal of Adhesion Science and Technology;1995-01

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