Investigations on the Corrosion Properties of Sn–0.5Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution-Reference-Cited by-同舟云学术

Investigations on the Corrosion Properties of Sn–0.5Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution

Published:2020-07-03 Issue:2 Volume:22 Page:150-159
ISSN:1229-7607
Container-title:Transactions on Electrical and Electronic Materials
language:en
Short-container-title:Trans. Electr. Electron. Mater.

Author:

Jayesh S.^ORCID,Elias Jacob

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s42341-020-00219-7.pdf

Reference22 articles.

1. M. Mel, Schwartz, Soldering: Understanding the Basics, 1st edn. (ASM International, West Conshohocken, 2014)

2. NCMS Lead-Free Solder Project Final Report, NCMS, National Center for Manufacturing Sciences, 3025 Boardwalk, Ann Arbor, Michigan 48108-3266, Report 0401RE96, August 1997

3. M. Mccormack, S. Jin, JEM 23, 715 (1994). https://doi.org/10.1007/BF02651364

4. J. Glazer, JEM 23, 693 (1994). https://doi.org/10.1007/BF02651361

5. Management Methods for Restriction of the Use of Hazardous Substances in Electrical and Electronic Products, http://www.chinarohs.com. Accessed 1 July 2019

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