1. R. L. Wahlers, S. J. Stein, M. A. Stein, et al., Ceramic Tapes for Wireless Applications, ACerS, St. Louis, MO (2000).
2. A. H. Feingold, C. Huang, S. J. Stein, and K. Low, “Low loss, low fire tape system for microwave applications,” in: Proc. of IMAPS Europe, Prague (2000), pp. 163–168.
3. R. R. Tummala, “Ceramic and glass ceramic packaging in the 1990s,” J. Am. Ceram. Soc., 74(5), 895–908 (1991).
4. S. H. Knickerbocker, A. H. Kumar, and L. W. Herron, “Cordierite glass ceramics for multiplayer ceramic packaging,” Am. Ceram. Soc. Bull., 72(1), 90–95 (1993).
5. A. S. Berezhnoi, “Estimates of the temperature limits of subsolidus state of multicomponent systems,” Izv. Akad. Nauk SSSR, Ser. Neorg. Mater., 6(8), 1396–1399 (1970).