The preparation of organic light-emitting diode encapsulation barrier layer by low-temperature plasma-enhanced chemical vapor deposition: a study on the $$\hbox {SiO}_\mathrm{x}\hbox {N}_\mathrm{y}$$ SiO x N y film parameter optimization-Reference-Cited by-同舟云学术

The preparation of organic light-emitting diode encapsulation barrier layer by low-temperature plasma-enhanced chemical vapor deposition: a study on the $$\hbox {SiO}_\mathrm{x}\hbox {N}_\mathrm{y}$$ SiO x N y film parameter optimization

Published:2014-03-18 Issue:3 Volume:27 Page:581-593
ISSN:0956-5515
Container-title:Journal of Intelligent Manufacturing
language:en
Short-container-title:J Intell Manuf

Author:

Kuo Chung-Feng Jeffrey,Lan Wei-Lun,Chang Yu-Cheng,Lin Kun-Wei

Publisher

Springer Science and Business Media LLC

Subject

Artificial Intelligence,Industrial and Manufacturing Engineering,Software

Link

http://link.springer.com/content/pdf/10.1007/s10845-014-0893-8.pdf

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4. Chiang, C. C., Wuu, D. S., Lin, H. B., Chen, Y. P., Chen, T. N., Lin, Y. C., et al. (2006). Deposition and permeation properties of SiN $$_{\rm x}$$ x /parylene multi-layers on polymeric substrates. Surface and Coatings Technology, 200(20–21), 5843–5848.

5. Cicek, A., Kivak, T., & Ekici, E. (2013). Optimization of drilling parameters using Taguchi technique and response surface methodology (RSM) in drilling of AISI 304 steel with cryogenically treated HSS drills. Journal of Intelligent Manufacturing. doi: 10.1007/s10845-013-0783-5 .

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