Joint modeling of classification and regression for improving faulty wafer detection in semiconductor manufacturing

Author:

Kang SeokhoORCID

Funder

National Research Foundation of Korea

Publisher

Springer Science and Business Media LLC

Subject

Artificial Intelligence,Industrial and Manufacturing Engineering,Software

Reference59 articles.

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4. Baly, R., & Hajj, H. (2012). Wafer classification using support vector machines. IEEE Transactions on Semiconductor Manufacturing, 25(3), 373–383.

5. Bradley, A. P. (1997). The use of the area under the ROC curve in the evaluation of machine learning algorithms. Pattern Recognition, 30(7), 1145–1159.

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