Innovative parametric design for environmentally conscious adhesive dispensing process
Author:
Publisher
Springer Science and Business Media LLC
Subject
Artificial Intelligence,Industrial and Manufacturing Engineering,Software
Link
http://link.springer.com/content/pdf/10.1007/s10845-013-0755-9.pdf
Reference39 articles.
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3. Chan, K. Y., Kwong, C. K., & Tsim, Y. C. (2010). Modelling and optimization of fluid dispensing for electronic packaging using neural fuzzy networks and genetic algorithms. Engineering Applications of Artificial Intelligence, 23, 18–26.
4. Chen, X. B., & Kai, J. (2004). Modeling of positive-displacement fluid dispensing processes. IEEE Transactions on Electronics Packaging Manufacturing, 27(3), 157–163.
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