Study of the effect of mutations in DNA repair genes on the thermal induction of error-free repair inEscherichia coli
Author:
Publisher
Springer Science and Business Media LLC
Subject
Applied Microbiology and Biotechnology,General Medicine,Microbiology
Link
http://link.springer.com/content/pdf/10.1007/BF01568933.pdf
Reference18 articles.
1. Craig EA (1985) The heat shock response. Crit Rev Biochem 18:238–280
2. Fitt PS, Sharma N (1988) Induction of error-free DNA repair inEscherichia coli by heat shock or nutritional stress. Curr Microbiol 19:61–65
3. Foster TW, Strike P (1988) Analysis of the regulatory elements of theEscherichia coli uvrC gene by construction of operon fusions. Mol Gen Genet 211:531–537
4. Friedberg EC (1985) DNA repair. New York: WH Freeman and Co
5. Grossman L, Caron PR, Mazur SJ, Oh Ey (1988) Repair of DNA containing pyrimidine dimers. FASEB J 2:2696–2701
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