Optimization of the required temperature of contact soldering of electronic devices-Reference-Cited by-同舟云学术

Optimization of the required temperature of contact soldering of electronic devices

Published:2013-09 Issue:5 Volume:86 Page:1060-1065
ISSN:1062-0125
Container-title:Journal of Engineering Physics and Thermophysics
language:en
Short-container-title:J Eng Phys Thermophy

Author:

Shtennikov V. N.,Seleznev V. D.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s10891-013-0928-6.pdf

Reference8 articles.

1. N. F. Lashko and S. V. Lashko, Soldering of Metals [in Russian], 2nd edn., Mashinostroenie, Moscow (1967).

2. V. N. Skokov and V. D. Seleznev, Introduction to the Physics of Nonequilibrium Processes [in Russian], Izd. Ural’sk. Gos. Tekh. Univ. — Ural’sk. Politekh. Inst., Ekaterinburg (2010).

3. A. V. Luikov, Heat and Mass Transfer: Handbook [in Russian], 2nd edn., Énergiya, Moscow (1978).

4. S. A. Zhdanok, O. G. Penyazkov, and N. A. Fomin, Development of R. I. Soloukhin’s scientific line of investigations at the Heat and Mass Transfer Institute, Inzh.-Fiz. Zh., 83, No. 6, 1041–1057 (2010).

5. V. N. Shtennikov, International IPC standards for soldering steel rods, Nano- Mikrosist. Tekh., No. 10, 28–29 (2009).

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