Modelling methods for In Vitro biomechanical properties of the skin: A review
Author:
Publisher
Springer Science and Business Media LLC
Subject
Biomedical Engineering
Link
http://link.springer.com/content/pdf/10.1007/s13534-015-0201-3.pdf
Reference78 articles.
1. Goldsmith LA. My organ is bigger than your organ. Arch Dermatol. 1990; 126:301–2.
2. Edwards C, Marks R. Evaluation of biomechanical properties of human skin. Clin Dermatol. 1995; 13:375–80.
3. Silver FH, Siperko LM, Seehra GP. Mechanobiology of force transduction in dermal tissue. Skin Res Technol. 2003; 9:3–23.
4. Weinstein GD, Boucek RJ. Collagen and elastin of human dermis. J Invest Dermatol. 1960; 35:227–9.
5. Elsner P, Berardesca E, Wilhelm KP, Maibach HI. Bioengineering of the skin-skin biomechanics. Boca Raton: CRC Press, 2002.
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Controllable Wound Closure in Artificial Skins using Dual-Layer Bioinspired Mechanism;2024 IEEE 7th International Conference on Soft Robotics (RoboSoft);2024-04-14
2. Fractal surface-based three-dimensional modeling to study the role of morphology and physiology in human skin friction;Surface Topography: Metrology and Properties;2024-01-29
3. Determination of Uniaxial Tensile Behavior of Hypodermis in Porcine Skin Based on Rule of Mixtures;Archives of Metallurgy and Materials;2023-07-26
4. Change of the polarization properties of the human dermis with directions of incident and observation;Optics and Lasers in Engineering;2023-07
5. WAXS and SAXS Investigation of Collagen-Rich Diet Effect on Multiscale Arrangement of Type I Collagen in Tilapia Skin Fed in Aquaponics Plant;Crystals;2022-05-14
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3