Metal–semiconductor interface engineering in layered 2D materials for device applications
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s12034-021-02512-4.pdf
Reference69 articles.
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5. Wang Q H, Kalantar-Zadeh K, Kis A, Coleman J N and Strano M S 2012 Nat. Nanotechnol. 7 699
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