Author:
Lin Kwang-Lung,Chen Kang-I,Shi Po-Cheng
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. I.E. Anderson and R.L. Terpstra, U.S. patent 6,231,691 (15 May 2001).
2. M. Hansen and K. Anderko, Constitution of Binary Alloy, 2nd ed. (New York: McGraw-Hill, 1985), pp. 52–54.
3. R.J.K. Wassink, Soldering in Electronics, 2nd ed. (Ayr, Scotland: Electrochemical Publications, 1989), p. 207.
4. Y. Miyazawa and T. Ariga, 1st Int. Symp. on Environmentally Conscious Design and Inverse Manufacturing (Los Alamitos, CA: IEEE Computer Society, 1999), pp. 616–619.
5. H. Mavoori, S. Vaynman, J. Chin, B. Moran, L.M. Keer, and M.E. Fine, Mater. Res. Soc. Proc. 390, 161 (1995).
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献