Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling-Reference-Cited by-同舟云学术

Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling

Published:2003-04 Issue:4 Volume:32 Page:278-286
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Liu X. W.,Plumbridge W. J.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-003-0222-z.pdf

Reference20 articles.

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2. K.C. Liu and J.G. Duh, IEEE Trans. Comp. Hybrids Manuf. Technol. 14, 703 (1991).

3. J. Lynch and A. Boetti, Thermal Stress and Strain in Microelectronics Packaging, ed. J.H. Lau (New York: Van Nostrand Reinhold, 1994), pp. 579–606.

4. J.H. Lau and Y.H. Pao, Solder Joint Reliability of BGA, CSP, Flip, Chip, and Fine Pitch SMT Assemblies (New York: McGraw-Hill, 1997), pp. 153–218.

5. R.N. Wild, Welding Res. Suppl. 51, 521s (1972).

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