Shear Strength and Failure Modes of As-Bonded Gold and Copper Ball Bonds on Aluminum Metallization-Reference-Cited by-同舟云学术

Shear Strength and Failure Modes of As-Bonded Gold and Copper Ball Bonds on Aluminum Metallization

Published:2012-02-24 Issue:7 Volume:41 Page:2018-2028
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Breach C.D.,Lee T.K.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-1923-y.pdf

Reference30 articles.

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3. B.K. Appelt, L. Huang, Y.S. Lai, and S. Chen. Electronic Packaging Technology and High Density Packaging (ICEPT-HDP). 2011 12th International Conference on 1–3 (2011).

4. B.K. Appelt, A. Tseng, Y.-S. Lai, and C.-H. Chen, China Semiconductor Technology International Conference 2011 (2011).

5. S. Kaimori, T. Nonaka, and A. Mizoguchi, Adv. Packag. IEEE Trans. 29, 227 (2006).

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