Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications-Reference-Cited by-同舟云学术

Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications

Published:2012-05-17 Issue:8 Volume:41 Page:2256-2266
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chidambaram Vivek,Yeung Ho Beng,Shan Gao

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-2107-5.pdf

Reference17 articles.

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3. J.J.M. Zaal, W.D. Van Driel, S. Bendida, Q. Li, J.T.M. Van Beek, and G.Q. Zhang, J. Microelectron. Reliab. 48, 8 (2008).

4. M. Chiao and L. Lin, J. Sens. Actuators A 91, 3 (2001).

5. W.-T. Park, J.-W. Jang, T. Clare, and L. Liu, Scr. Mater. 64, 8 (2011).

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