Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding-Reference-Cited by-同舟云学术

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Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding

Published:2006-01 Issue:1 Volume:35 Page:123-131
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Islam Rashed Adnan,Chan Y. C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-006-0194-x.pdf

Reference21 articles.

1. Y. Fu, M. Willander, and J. Liu, IEEE Trans. Compon. Packaging Technol. 24, 250 (2000).

2. D.D. Chang, J.A. Fulton, A.M. Lyons, and J.R. Nis, Proc. Nepcon W (1992), p. 1381.

3. M. Yim and K. Paik, IEEE Trans. Compon. Packaging Technol. Part A 21, 226 (1998).

4. A. Nagai, K. Takemure, K. Isaka, O. Watanabe, K. Kojima, K. Matsuda, and I. Watanabe, Proc. IEMT/IMC (1998), pp. 353–357.

5. R. Aschenbrenner, R. Miebner, and H. Reichl, J. Electron. Manufacturing 7, 245 (1997).

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microwave synthesis, charaterisation and electrochemical property of cucurbit[n]urils;Materials Research Innovations;2013-12-06

2. Conductivities and curing properties of electron-beam-irradiated anisotropic conductive films;Journal of the Korean Physical Society;2012-07

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