1. R. Tummala, Fundamentals of Microsystems Packaging, Vol. 1 (New York City: McGraw-Hill Education, 2001).
2. J. Chen, in Department of Electrical Engineering and Computer Sciences, University of California at Berkeley, (2016).
3. M. Popovich, A.V. Mezhiba, and E.G. Friedman, Power Distribution Networks with On-chip Decoupling Capacitors, 2nd ed. (New York, NY: Springer, 2011).
4. GRM033R61A104ME15D, Murata Electronics, Catalog No. C02E- 21.
5. CL02A104KQ2NNNC, Samsung Electro-Mechanics, Multilyer Ceramic Capacitors