An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints-Reference-Cited by-同舟云学术

An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints

Published:2012-12-11 Issue:2 Volume:42 Page:240-248
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Muralidharan Govindarajan,Kurumaddali Kanth,Kercher Andrew K.,Walker Larry,Leslie Scott G.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-012-2341-x.pdf

Reference17 articles.

1. S. Rogers, U.S. Department of Energy, Vehicle Technologies Program, Advanced Power Electronics and Electric Motors (APEEM) R & D, October 27, 2009.

2. R.O. Dennis and H.M. Berg, IEEE T. Compon. Hybr. CHMT-2(2), 257–263 (1979).

3. F.P. McCluskey, R. Grzybowski, and T. Podlesak, eds., High Temperature Electronics (Boca Raton: CRC, 1997), pp. 136–147.

4. P. Viswanadham, S.O. Dunford, and J. Kivilahti, in Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Eds. K.J. Puttilz and K.A. Stalter (Marcel Dekker, New York, 2004), pp. 769–825.

5. King-Ning Tu, Solder Joint Technology (New York: Springer, 2007).

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