1. Directive 2002/96/EC,
http://www.dti.gov.uk
. Accessed 2 October 2011.
2. IPC-4553, Specification for Immersion Silver Plating for Printed Circuit Boards, September 29 (2005).
3. IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, October (2002).
4. IPC-TR-585, Time, Temperature and Humidity Stress of Final Board Finish Solderability, May (2006).
5. R. Veale, Proceedings SMTAI, Illinois, USA (2005).