Author:
Min Kyoung-Jin,Park Sung-Cheol,Lee Kyu Hwan,Jeong Yongsoo,Park Young-Bae
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. D.P. Seraphim, R. Lasky, and C.Y. Li, Principles of Electronic Packaging (New York: McGraw-Hill, 1989), pp. 351–353.
2. M.H. Kim and K.W. Lee, Met. Mater. Int. 12, 425 (2006).
3. S.H. Kim, S.W. Na, N.E. Lee, Y.W. Nam, and Y.H. Kim, Surf. Coat. Tech. 200, 2072 (2005).
4. A.M. Ektessabi and S. Hakamata, Thin Solid Films 377–378, 621 (2000).
5. G.S. Chang, S.M. Jung, Y.S. Lee, I.S. Choi, C.N. Whang, J.J. Woo, and Y.P. Lee, J. Appl. Phys. 81, 135 (1997).
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