Optimization of Microscale Thermoelectric Cooling (TEC) Element Dimensions for Hotspot Cooling Applications-Reference-Cited by-同舟云学术

Optimization of Microscale Thermoelectric Cooling (TEC) Element Dimensions for Hotspot Cooling Applications

Published:2009-02-19 Issue:7 Volume:38 Page:950-953
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hou P.Y.,Baskaran R.,Böhringer K.F.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-009-0694-6.pdf

Reference5 articles.

1. D.S. Chau, G. Chrysler, S. Narasimhan, D. Ganapathy, and K. Lofgreen, The Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM ’06), San Diego, CA, 30 May–2 June 2006

2. P. De Bock and T. Icoz, Proceedings of IPACK2007, ASME InterPACK ’07, Vancouver, BC, Canada, 8–12 July 2007

3. A.M. Pettes, M.S. Hodes, and K.E. Goodson, Proceedings of IPACK2007, ASME InterPACK ’07, Vancouver, BC, Canada, 8–12 July 2007

4. V.A. Semenyuk, Thermoelectrics Handbook: Macro to Nano, Chap. 5 (CRC, Boca Raton, FL)

5. K. Wang, R. Baskaran, and K.F. Böhringer, Third Annual Conference on FNANO, Snowbird, UT, 23–27 April 2006

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