Heat Sinks for Miniature Thermoelectric Coolers: Selection and Characterization-Reference-Cited by-同舟云学术

Heat Sinks for Miniature Thermoelectric Coolers: Selection and Characterization

Published:2014-05-01 Issue:6 Volume:43 Page:2452-2458
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Semenyuk V.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-014-3157-7.pdf

Reference7 articles.

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2. K.J. Negus and M.M. Yovanovich, Proceedings of the International Symposium on Cooling Technology for Electronic Equipment, (Honolulu, HI, 1987), pp. 563–574.

3. M.M. Yovanovich, AIAA Progress in Astronautics and Aeronautics.Radiative Transfer and Thermal Control, Vol. 49, ed. A.M. Smith (New York: AIAA, 1976), pp. 397–418.

4. M.H.N. Naraghi and V.W. Antonetti, ASME publication HTD, Vol. 263, Enhanced Cooling Techniques for Electronics Applications, ed. S.V. Garimella et al. (1993), pp. 107–114, Presented at the ASME Winter Annual Meeting (New Orleans, Louisiana, Nov. 28–Dec. 3, 1993).

5. S. Lee, S. Song, V. Au, and K.P. Moran, ASME/JSME Thermal Engineering Conference, Vol. 4 (Maui, HI: ASME, 1995), pp. 199–206.

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