1. H. Klauk, B. D’Andrade, and T.N. Jackson, 57th Annual Device Research Conference Digest (New York: IEEE Press, 1999), p. 162.
2. B.K. Crone, A. Dadabalapur, R. Sarpeshkar, R.W. Filas, Y.Y. Lin, and Z. Bao, Appl. Phys. Lett. 89, 5125 (2001).
3. J.M. Hoey, M.T. Reich, A. Halvorsen, D. Vaselaar, K. Braaten, M. Maassel, I.S. Akhatov, O. Ghandour, P. Drzaic, and D.L. Schulz, IEEE Trans. Adv. Packag. 32, 809 (2009).
4. B.K. Crone, A. Dodabalapur, A. Gelperin, L. Torsi, H.E. Katz, and A.J. Lovinger, Appl. Phys. Lett. 78, 2229 (2001).
5. M. Mantysalo and P. Mansikkamaki, NIP23/Digital Fabracation (Anchorage, Alaska: Society for Imaging Science and Technology, 2007), p. 813.