Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique-Reference-Cited by-同舟云学术

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Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique

Published:2015-05-12 Issue:7 Volume:44 Page:2497-2506
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen Pei-Chi,Su Yen-Fu,Yang Shin-Yueh,Liang Steven Y.,Chiang Kuo-Ning

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-015-3807-4.pdf

Reference19 articles.

1. S. Michaelides and S.K. Sitaraman, IEEE Trans. Adv. Packag. 22, 602 (1999).

2. K.X. Hu, C.P. Yeh, B. Doot, A.F. Skipor, and K.W. Wyatt, Proceedings of the 45th Electronic Components and Technology Conference (Las Vegas, NV, 1995), p. 293.

3. S.F. Popelar, Proceedings of the 4th International Symposium on Advanced Packaging Materials (Braselton, GA, 1998), p. 41.

4. T.T. Wang and B. Shang, J. Mech. 30, N5 (2014).

5. F. Su, W.J. Li, T.B. Lan, and W. Shang, J. Mech. 30, 625 (2014).

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bending Strength Evaluation of Si Interposers by PoEF Test Associated With Acoustic Emission Method;IEEE Transactions on Device and Materials Reliability;2017-06

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