Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls-Reference-Cited by-同舟云学术

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Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls

Published:2008-04-23 Issue:7 Volume:37 Page:975-981
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Yu Yang,Xia Zhidong,Guo Fu,Shi Yaowu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-008-0454-z.pdf

Reference15 articles.

1. M.D. Ries, D.R. Banks and D.P. Watson, IBM J. Res. Dev. 37, 597 (1993)

2. J.H. Chun and C.H. Passow, U.S. patent 5,266,098 (1993).

3. J. Tang, G.B. Hess, M.D. Muszynski, and T.S. Goehring, U.S. patent 5,891,212 (1999).

4. M. Orme-Marmerelis and R.F. Smith, U.S. patent 6,491,737 (2002).

5. J.H. Lee, B.C. Moon, J. Lee, J.T. Moon, C.R. Oh, and J.G. Nam, U.S. patent 6,312,498 (2003).

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2. Role of cerium in microstructure and corrosion properties of Sn-1.0Ag solder alloys;Materials Letters;2018-10

3. Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate;Metals and Materials International;2014-05

4. Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder;Materials Science and Engineering: A;2012-12

5. The effect of praseodymium (Pr) additions on shear strength and microstructure of SnAgCu joints during the ageing process;Soldering & Surface Mount Technology;2012-06-22

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