Author:
Umarji Govind,Qureshi Nilam,Gosavi Suresh,Mulik Uttam,Kulkarni Atul,Kim Taesung,Amalnerkar Dinesh
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. H.J. Song, K. Ajito, Y. Muramoto, A. Wakatsuki, T. Nagatsuma, and N. Kukutsu, Electron. Lett. 48, 1 (2012).
2. S. Chen and J. Zhao, IEEE Commun. Mag. 1, 36 (2014).
3. T.T.Sunoda, Y.R. Kasai, N.S. Ota, K. Sawada, Y. Yamamoto, Y. Fukuoka, and S. Sagara, International Conference on Electronics Packaging (ICEP) (2014), pp. 50–54. doi: 10.1109/ICEP.2014.6826659 .
4. R.S. Theodore, S. Shu, M. Rimma, Z. Hang, A. Yaniv, W. Kevin, W.N. George, S.K. Jocelyn, S. Mathew, and G. Felix, IEEE Access. 1, 335 (2013).
5. D. Ortolino, A. Engelbrecht, H. Lauterbach, M. Bräu, J. Kita, and R. Moos, J. Ceram. Sci. Technol. 5, 317 (2014).
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