Experimental Approach to Determine Damage Curves for SnAgCu Solder Under Sequential Cyclic Loads-Reference-Cited by-同舟云学术

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Experimental Approach to Determine Damage Curves for SnAgCu Solder Under Sequential Cyclic Loads

Published:2019-11-26 Issue:2 Volume:49 Page:1412-1420
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

George Elviz,Chen Deng Yun^ORCID,Osterman Michael,Pecht Michael

Funder

Center for Advanced Life Cycle Engineering

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07811-5.pdf

Reference13 articles.

1. M. Miner, J. Appl. Mech. 12, 159 (1945).

2. A. Palmgren, Zeitschrift des Vereines Deutscher Ingenieure 68, 339 (1924).

3. D. Kujawski and F. Ellyim, Int. J. Fract. 37, 4 (1988).

4. P. Haswell, Ph.D. Dissertation (College Park, Maryland, 2001).

5. N. Iosipescu, J. Mater. 2, 537 (1967).

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