Wettability of electroless Ni in the under bump metallurgy with lead free solder-Reference-Cited by-同舟云学术

Wettability of electroless Ni in the under bump metallurgy with lead free solder

Published:2001-05 Issue:5 Volume:30 Page:543-553
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Young Bi-Lian,Duh Jenq-Gong,Chiou Bi-Shiou

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-001-0096-x.pdf

Reference25 articles.

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3. R.C. Marrs, Proc. 2nd Int. Conf. and Exhibition on Multichip Modules (Piscataway, NJ: IEEE, 1993), p. 220.

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5. D.R. Frear, F.M. Hosking, and P.T. Vianco, Materials Developments in Microelectronic Packaging and Reliability (Materials Park, OH: ASM, 1991, 1991), p. 229.

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