Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. P. Jaiswal and C.K. Dwivedi, Int. J. Innov. Technol. Creative Eng. (IJITCE) (2011). http://ia800305.us.archive.org/34/items/IJITCE/IJITCE_May3.pdf. Accessed 4 May 2011.
2. S. Narumanchi, M. Mihalic, K. Kelly, and G. Eesley, in ITHERM Conference Proceedings (2008). https://doi.org/10.1109/itherm.2008.4544297.
3. R. Prasher and C.P. Chiu, in Materials for Advanced Packaging. ed. By D. Lu and C. Wong (Springer, 2017), p. 511.
4. I. Hu, M. Shih, and G. Kao, in IMPACT´15 Conference Proceedings (2015). https://doi.org/10.1109/impact.2015.7365218.
5. G.K. Morris, M.P. Polakowski, L. Wei, M.D. Ball, M.G. Phillips, C. Mosey, and R.A. Lukaszewski, in IWIPD Conference Proceedings (2015). https://doi.org/10.1109/iwipp.2015.7295991.
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献