Encapsulation of lead-free Sn/Zn/Bi solder alloy particles by coating with wax powder for improving oxidation resistance-Reference-Cited by-同舟云学术

Encapsulation of lead-free Sn/Zn/Bi solder alloy particles by coating with wax powder for improving oxidation resistance

Published:2005-05 Issue:5 Volume:34 Page:647-654
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Iwasaki Tomohiro,Kim Jeong Hwan,Mizuhashi Shohei,Satoh Munetake

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-005-0079-4.pdf

Reference18 articles.

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2. I. Shohji, C. Gagg, and W.J. Plumbridge, J. Electron. Mater. 33, 923 (2004).

3. T. Takemoto, M. Miyazaki, and A. Matsunawa, Proc. 3rd Int. Conf. on ECOMATERIALS (Tsukuba, Japan: The Society of Non-Traditional Technology, 1997), pp. 63–66.

4. T. Takemoto, Proc. EcoDesign ’99: 1st Int. Symp. on Environmentally Conscious Design and Inverse Manufacturing (Tokyo: Union of EcoDesineers, 1999), pp. 964–969.

5. M. McCormack, S. Jin, and H.S. Chen, J. Electron. Mater. 23, 687 (1994).

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