Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration-Reference-Cited by-同舟云学术

Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration

Published:2020-08-27 Issue:3 Volume:50 Page:699-709
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Sheikh Mohamed,Hsiao Andy,Xie Weidong,Perng Steven,Lee Tae-Kyu^ORCID

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-020-08409-y.pdf

Reference15 articles.

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3. T.-K. Lee, T. Bieler, C. Kim, and H. Ma, Fundamentals of Lead-Free Solder Interconnect Technology (Berlin: Springer, 2015), pp. 169–210.

4. M. Kelly, M. Jeanson, T. Younger, J. Bielick, T. Lewis, and M. Ferrill, J. SMT 30, 28–36 (2017).

5. T.-K. Lee, B. Zhou, T. Bieler, and K.-C. Liu, J. Electron. Mater. 41, 273–282 (2012).

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